LT-MS-300

Table Spin Coater

  • Spin coater suitable for 12” wafer bumping process
  • Manually wafer setting, opening/closing the cover, and liquid dispensing
  • 4” touch screen, Chuck spinning speed and time control with recipe
  • Machine size:420(W)*500(D)*454(H), placed on the worktable operation for space saving
Specification
  • Table type spin coater
  • Suitable for 12” Wafer
  • 220V, 1 phase, 5A
  • Spin speed 3000 rpm (Max.)
  • 4” touch screen, controlled with PLC
  • Vacuum pump(<70KPa) for Chuck sucking
  • Recipe: 20 Step 20EA

Application
• PR coater for bumping process

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Table Spin Coater
Spin coater suitable for 12” wafer bumping process Manually wafer setting, opening/closing the cover, and liquid dispensi ...
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