LT-MS-300
Table Spin Coater
- Spin coater suitable for 12” wafer bumping process
- Manually wafer setting, opening/closing the cover, and liquid dispensing
- 4” touch screen, Chuck spinning speed and time control with recipe
- Machine size:420(W)*500(D)*454(H), placed on the worktable operation for space saving
Specification
- Table type spin coater
- Suitable for 12” Wafer
- 220V, 1 phase, 5A
- Spin speed 3000 rpm (Max.)
- 4” touch screen, controlled with PLC
- Vacuum pump(<70KPa) for Chuck sucking
- Recipe: 20 Step 20EA
Application
• PR coater for bumping process