企業沿革

技術沿革

  • 2007
    • 推出鋼網清洗機
  • 2008
    • 線上離線式PCBA清洗機
  • 2009
    • 完善SMT產品線
  • 2011
    • CCM模組及晶圓清洗設備
  • 2012
    • IGBT & BGA SIP半導體封裝清洗設備
  • 2014
    • 線上式半導體清洗設備銷往日本
  • 2016
    • 晶圓8"/12"溼製程設備
  • 2017
    • 8" Wafer Semi-Auto Type Metal Lift-Off PR Stripper
  • 2018
    • Semi-Auto 12" Wafer Ti/Cu Spin Etcher
  • 2019
    • 6"~12" Single Wafer Brush Cleaner
    • 8"/12" Compatible Spin Promotor
  • 2020
    • 6"/8"/12" Metal Lift Off PR Stripper
    • 8" Thin Wafer BGBM Backside Spin Etcher
  • 2021
    • GaAs/InP/SiC/GaN Multi-Chemicals Reclaim Spin Etcher
    • 8" Thin Wafer 4 Chambers BGBM Backside Spin Etcher
  • 2022
    • 12" Thin Wafer Backside Bernoulli Spin Etcher
    • Fully Auto SECS-GEM/E84 Single Wafer Tool On Line
  • 2023
    • 12" Wafer PR Spin Coater
    • 12" Wafer UBM/RDL/Cu Pillar Plater