AST-E300

Single Wafer Spin Etcher

  • Single wafer set etching spin processor,using for UBM、RDL 、BGBM and different metal etching, cleaning and resistance remove。
  • Different chamber design, good chemical recovery rate, and different chemical process in one chamber.
  • Precision control of spin arm and spray device to control the chemical spray evenly.

Features
  • Process uniformity is available to adjust with recipe;
  • Single wafer conditions can be controllable and traceability;
  • Process parameter is easy to adjust.
  • Control the chemical usage and ensure each chips have same process conditions
  • Better safety than bench type.
  • Cleanliness control better than batch method;
  • Small footprint
  • Suitable for wafer dry in/ dry out process
Application
8&12 inch wafer etching process, esp. for UBM、RDL, BGBM and metal

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Single Wafer Spin Etcher
Single wafer set etching spin processor,using for UBM、RDL 、BGBM and different metal etching, cleaning and resistance re ...
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