AST-E02-SP
Auto Single Wafer Ultrasonic Spray Coater
- The device is a fully automatic ultrasonic spraying machine, which can realize the automatic wafer operations of taking, aligning, spraying, cutting edge, baking and releasing.
- Intelligent control system design can not only provide a friendly graphical operation interface, but also free plan the production process according to the process requirements.
- Ultrasonic spraying uses piezoelectric materials to convert electrical energy into mechanical energy, and the fluid is atomized through concussion, in this way, the coating droplets are uniform and fine, and the material utilization is effectively improved.
- The ultrasonic nozzle is designed with a large diameter feeding channel, which can effectively avoid the occurrence of pipeline blockage, reduce equipment downtime and maintenance time, and improve the operating ratio of equipment.
- Different from the spin diffusion coating of Spin Coater, the ultrasonic spray coating uses gentle and micro droplets beginning to deposit coating from the base material, and the performance of the step coverage is superior.
- Use spin speed to cooperate with nozzle movement speed and continuously implement spin spray coating, which can effectively improve production capacity, and can eliminate the film thickness difference caused by path difference during back and forth spray coating by general equipment.
- A numerical simulation of the chamber structure is carried out to optimize the flow channel geometry design and avoid the particle backflow pollution to the coating chamber.
Specification
- The ultrasonic actuator can produce a vibration frequency of 120KHz, which can atomize the liquid into 18 µm droplets.
- Micro flow multi-piston feeding system is not only available for continuous feeding, but also can provide the flow of 1 µl/min~25ml/min, which can meet various process requirements.
- The ultrasonic nozzle is driven by the servo motor, the movement speed can reach up to 200mm/sec, and can be changed in time according to the process planning.
- The unique multi-pore ceramic heating platform can be heated up to 60°C and can simultaneously implement vac-sorb and heating wafers.
- The independent cold and hot plate grooves are suitable for wafer soft bake after coating.
Application
- Photoresist spray coating
- Flux spray coating
- LED phosphor spray coating
- Solar-power paint spray coating
